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BGA REWORK SYSTEM
Part Number: FR1418-01
The Hakko FR-1418 BGA Rework System is constructed of heavy-walled aluminum castings for unsurpassed precision and stability and uses precisely controlled solder reflow profiles. The system features a unique gantry style construction similar to that of a pick-and-place machine, which allows the PCB to remain stationary while the head moves to accomplish the X, Y, Z and Theta alignment.
The Z-axis travel and component placement is manually controlled. The bottom heater is a single zone (10 x 12 inches) large area, low mass infra-red heater that provides fast, efficient heating and eliminates board warping. The Hakko FR-1418 BGA rework system is designed
for the manual alignment and placement or removal of BGA, ΅BGA, CSP and other
surface mount components with repeatable solder reflow profiles.


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GANTRY SYSTEM
Unique gantry system allows the PCB to remain stationary while the head is
manually moved to accomplish the X, Y, Z and Theta alignment.
The design allows the capacity to rework boards up to 14 x 18 inches in a
smaller footprint with simple board fixture.
Rigid structure for stability and accurate component placement
Rapid movement handle allows fast, easy X-Y alignment along smooth motion
gantry
• Fine adjust with fine-threaded adjustment knobs |
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BOARD and COMPONENT CAPACITY
Board capacity: 2 x 2 inch minimum, 14 x 20 inch maximum (larger board sizes possible)
PCB thickness up to 0.25 inch (6.4 mm)
Able to remove components up to 1.5 in. tall
Component sizes: 0.08 inch (2.0 mm) square minimum, 2 inch (51 mm) square maximum
Able to handle both grid array and leaded-typed components (BGA, CGA, QFP,
LCC, TSOP and many others.)
Placement accuracy to +/- 0.002 inches
Fully adjustable PCB holding fixture standard
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CONTROL SYSTEM
• Pentium Class PC with Windows-based operating system
• Recipe controls parameters for Preheat, Soak, Reflow, and Cool Down
• Unlimited recipe storage
• Advanced, automatic profiling capabilities
• Video capture card with flat screen monitor provides clear viewing during component placement
• "Teach" mode profiling sets the recipe times based on the input operating and target temperatures
• Password protection prevents unauthorized use or adjustment of recipes
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1000W TOP HEATER
Forced convection hot gas system
Heater head with built in vacuum pick-up and Theta adjustment
• Various interchangeable vacuum tips and cups available
Low, medium, and high gas flow
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LOW MASS INFRARED PREHEATER
Large area, low mass infra-red heaters provides fast, efficient heating and eliminates board warping
Standard: 750W single zone IR array (10x12")
• Optional: 1500W single zone High Density IR array (10x12")
• Optional: 1500W dual zone IR array (12x20")
• Optional: 3000W 240V two zone High Density IR array (12x20")
True proportional control (0-100% power)
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FOUR (4) THERMOCOUPLE INPUT PORTS
Real-time process monitoring and development
• TEACH, BOARD and two SPARE thermocouples
• Control system graphs thermocouple temperatures |

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OPTICS
Beam-splitting prism allows LookUp/LookDown vision with LED lighting
• Top and bottom lighting independently adjusted
• Optional Pan and Tilt mirror allows zoom in and scanning of image
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CCD VIDEO CAMERA
Color camera with fixed mirror
• Focus, zoom and aperature control
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